Advantech doubles up on demos

Global manufacturer Advantech has arrived at ITS America Conference & Expo in Phoenix to show off how its Embedded Box IPC systems can be used in ITS solutions.
April 23, 2024
© Chris Curtis | Dreamstime.com
© Chris Curtis | Dreamstime.com

The first demo, with Intel, will showcase the Advantech MIC-770 V3 IPC powered by an Intel 12th/13th Gen Core i CPU. The unit captures environmental dimensions and shapes via Lidar cameras, and relays the data to the GPU that then generates detailed 3D models of roadways.

The power and scalability of the joint solution makes the solution ideal for Artificial Intelligence of Things (AIoT) applications that require deep learning and edge inference—particularly in Lidar-based sensing.

The second demo, with Ouster, will feature the Advantech MIC-733-AO, a system designed to grow transportation and smart city trends in Video AI. The system’s high processing capabilities, versatile video input options and wireless connectivity make it ideal for advanced video AI and 5G applications on the edge of the network.

Booth 1748

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